“Fake” chips present a huge issue for manufacturing companies trying to source ICs from non-traditional channels, writes Electronic Design.
Counterfeiting semiconductors has been a rapidly increasing trend, impacting a wide variety of electronics systems used by a wide gamut of involved parties—consumers, businesses, and military customers. The detection of counterfeit components has become an increasingly important priority for electronics manufacturers and component suppliers worldwide.
“ICs aren’t hard to fake, unlike banknotes. Making “lookalike” parts that resemble real ones takes very little skill. It simply requires finding cheap parts in the same format of package and merely painting new marks on them,” writes Electronic Design. “The most prevalent counterfeiting technique is selling re-badged products. It’s a simple matter to remove the existing mark from a chip package and put on a new logo and part number, or a different brand or a different speed—and then sell the semiconductor to an unsuspecting buyer who has no way of making sure that the product is ‘real’. Sometimes the chip is merely an empty package with no die inside”
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