demand for automotive MCUs and MPUs is still on the rise, according to leading OSATs and chip packaging material suppliers to the semiconductor industry.
ASE (Advanced Semiconductor Engineering) are among those have secured orders for automotive MCU back-end outsourcing for the next two quarters from international IDM (Integrated device manufacturer) companies, according to sources. Examples of IDMs are Intel, Samsung, and Texas Instruments.
Automotive chip IDM is expected to slightly reduce its outsourcing back-end orders in the second half of 2023, but it is uncertain whether the demand for automotive MCUs and MPUs will reverse in the second half of next year, as the backlog of orders remains strong.
According to Reuters, STMicroelectronics expects its factories to run at full steam well into 2023 as backlog is filled by the auto and smartphone industries, prompting it to raise its 2022 outlook and build new production lines.
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