Intel plans to invest up to $4.6B to set up a semiconductor assembly and test facility near Wrocław, Poland, to help the EU work toward its goal of a more resilient semiconductor supply chain.
The factory will help meet the demand for assembly and test capacity that the company expects by 2027.
About 2,000 Intel jobs and thousands of indirect supplier and temporary construction jobs will be created, according to the company. Design and planning for the site will start immediately, and construction will begin after approval of the European Commission.
Recently, it was reported that Intel was close to a deal with the German government to receive up to $10.8B in subsidies for a new manufacturing plant in Magdeburg, Germany.
Intel said that the investment in Poland, its existing wafer fabrication facility in Leixlip, Ireland, and its planned wafer fabrication facility in Magdeburg, Germany, will help create a first-of-its-kind end-to-end leading-edge semiconductor manufacturing value chain in Europe.
“We’re grateful for the support from Poland as we work to grow the local semiconductor ecosystem and contribute to the EU’s goal of creating a more resilient and sustainable semiconductor supply chain,” said Intel CEO Pat Gelsinger.
Wafer fabrication facilities (also known as ‘fabs’) create chips on silicon wafers via certain processes. Facilities, such as the one planned near Wrocław, receive completed wafers from fabs, cut them into individual chips, assemble them into final products and test them for performance and quality. These finished chips are then shipped to customers, Intel noted.
This news is a sure indication of Intel’s commitment to helping the EU fulfil its goal of a more resilient semiconductor supply chain and the look forward to the further developments in the project.
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