The semiconductor industry is poised for a transformative decade, marked by geopolitical shifts, advancements in artificial intelligence (AI), and the drive toward clean energy. In this dynamic landscape, the Semiconductor Research Corporation (SRC) has released the MAPT Roadmap, a critical guide designed to steer the chip market through these changes and challenges.
Following the Jan 2021 release of the Decadal Plan for Semiconductors, the MAPT Roadmap delves deeper, offering actionable strategies to address the broad needs outlined in the Decadal Plan. This roadmap, a collective effort of over 300 experts from leading chip companies, academia, and government organizations, focuses on system-level goals in chip innovation. SRC chief scientist Dr. Victor Zhirnov emphasizes the significance of this collaborative effort.
The MAPT Roadmap aligns with the five key shifts identified in the Decadal Plan: smart sensing, communication, security, memory and storage, and energy efficiency. It highlights the importance of research in advanced packaging, 3D integration, nanoscale manufacturing, and new materials. These areas are deemed essential for overcoming the current technological and sustainability limits in semiconductor production.
SRC president and CEO Dr. Todd Younkin underscores the roadmap’s support for the CHIPS and Science Act, led by the U.S. Department of Commerce, in fostering a robust domestic chip ecosystem. The roadmap addresses the challenges of scaling down semiconductor components, recognising the need for innovative approaches like chiplet packaging and 3D integration to sustain generational advances.
The MAPT Roadmap is set to be a guiding light for the industry, urging companies at the forefront of chip innovation to embrace its recommendations. Collaborative research and development efforts are crucial to advancing the industry and shaping the next generation of technology.
In the broader context of chip manufacturing, the industry is witnessing significant developments. Canon is introducing a nanoimprint lithography machine capable of producing 5nm node chips, presenting a challenge to ASML’s EUV technology. Meanwhile, the U.S. is tightening restrictions on advanced chip and equipment sales to China, reflecting the complex interplay of technology, politics, and global supply chains. These moves exemplify the rapidly evolving nature of the semiconductor industry, underlining the importance of strategic planning and innovation as outlined in the MAPT Roadmap.
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