The worldwide semiconductor industry is projected to invest more than $500 billion in 84 volume chipmaking facilities starting construction from 2021 to 2023, posts SEMI in this report.
They forecast 33 wafer fabs will start construction in 2022 and 28 in 2023.
Demand for chips to go into high-performance computing, datacenters and automobiles is driving the increases, SEMI said.
Ajit Manocha, CEO of SEMI, said that government incentives around the world to expand production and strengthen supply chains was also having an impact. “With the bullish long-term outlook for the industry, rising investments in semiconductor manufacturing are critical to laying the groundwork for secular growth driven by a diverse range of emerging applications.”
China is set to outnumber all other regions with 20 facilities although these are supporting mature technologies
The Americas region will see 18 wafer fabs and semiconductor facilities start construction from 2021 through the end of 2023.
Europe and the Middle-East will start construction of 17 fabs between 2021 and 2023.
Taiwan‘s new facility count is 14 while Japan and the Southeast Asia are expected to begin building six facilities each over the forecast period.
South Korea is forecast to start construction on three large facilities.
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