31 Jan 2024 -
 Industrial, General

Giants Intel and UMC announce new foundry team-up

intel HQ

Intel and United Microelectronics (UMC), a leading semiconductor foundry, are joining forces to create a 12-nanometer process platform for high-growth sectors such as mobile, communication infrastructure, and networking. Combining Intel’s massive US manufacturing capacity with UMC’s extensive foundry expertise in mature nodes will result in a wider range of processing options.

This collaboration also gives global clients more options when deciding where to source their products, providing them with access to a more geographically diversified and resilient supply chain.

Stuart Pann, Intel’s senior vice president and general manager of Intel Foundry Services (IFS), said, “Taiwan has been a crucial component of the Asian and global semiconductor and broader technology ecosystem for decades, and Intel is committed to collaborating with innovative firms in Taiwan, such as UMC, to better serve global clients. Intel’s strategic alliance with UMC further demonstrates our commitment to delivering technology and manufacturing innovation across the global semiconductor supply chain and is another important step toward our goal of becoming the world’s second-largest foundry by 2030.”

Jason Wang, UMC’s co-president, stated, “Our collaboration with Intel on a US-manufactured 12 nm process with FinFET capabilities is a step forward in advancing our strategy of pursuing cost-efficient capacity expansion and technology node advancement in the interest of our clients. This effort will allow our clients to seamlessly migrate to this critical new node while also benefiting from the resilience of an added Western footprint,” he said.

The 12 nm node will leverage Intel’s US high-volume manufacturing capacity and expertise in FinFET transistor design, while also benefiting from UMC’s experience in providing clients with Process Design Kit (PDK) and design assistance for effective foundry services.

The new process node will be developed and manufactured in Fabs 12, 22, and 32 at Intel’s Ocotillo Technology Fabrication facility in Arizona. Utilising existing equipment in these fabs will significantly decrease upfront investment requirements and improve efficiency. Production of the 12 nm process is scheduled to start in 2027.

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