According to IC Insights, wafer capacity grew 8.5% last year and it is expected to jump an extra 8.7% in 2022, registering an all-time high in wafer starts.
The 8.7% jump in IC industry capacity forecast for 2022 will come primarily from the addition of 10 new 300mm wafer fabs that are scheduled to open this year (three less than were added in 2021), reports IC Insights.
The biggest increases in capacity are expected to come from the large new memory fabs of SK Hynix and Winbond as well as the three new fabs (two in Taiwan; one in China) from TSMC, the world’s largest pure-play foundry. Other new 300mm fabs include CR Micro’s fab for power semiconductors; Silan’s fab for power discretes and sensors; TI’s RFAB2 facility for analog devices; ST/Tower’s fab for mixed-signal, power, RF, and foundry; and SMIC’s new fab for foundry operations.
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